Dual Beam FIB-SEM combined with a monochromated Field Emission SEM column and a Ga LMIS ion column. This combination allows high-resolution SEM imaging at low acceleration voltages during precise slicing at nanometer orders. With the use of the fully automated TEM sample prep system (AutoTEM5), thin lamella preparation from lift-out to thinning and also low-kV surface cleaning will be done automatically. The CMOS EBSD detector allows rapid crystal orientation mapping, which is a powerful for 3D EBSD serial sectioning.

SEM	Gun	Monocromated Schottky Emission
	Acceleration Voltage	0.35 kV - 30 kV
	Detectors	Through Lens SE/BSE Detector (TLD)
		Mirror Detector BSE (MD)
		Everhart-Thornley SE Detector (ETD)
		Everhart-Thornley SE検出器(ETD)
		In-Chamber Secondary Electron & Ion Detector (ICE)
		Directional BSE Detector (CBS/ABS)
FIB	Ion Source	Ga LMIS
	Acc. Voltage	0.5 - 30 kV
	Max. Probe Current	65 nA
FIB-SEM Geometry		V-shape (52 deg)
WD		４ｍｍ
GIS		Platinum, Tungsten, Carbon
Max Sample Size		150 mm in diameter, 55 mm in height
in-situ Lift-out		EasyLift
Low-energy broad ion milling		-
Automation	TEM sample prep.	AutoTEM 5
	Serial Sectioning	Auto Slice & View 5
	Montage Imaging	MAPS 3
	Python Scripting	AutoScript 4
Analysis	XEDS	-
	EBSD	Oxford Symmetry S3
Cryo Stage		Thermo Scientific CryoMAT
Air-Free Transfer		〇
Plasma Cleaning		〇